Product description

This equipment is mainly used in silicon wafer laser cutting,Remove human or mechanical processing and other reasons cause edge damage or rupture,and increase the overall level of the silicon wafer。

Product advantage

Cutting dimensions cover the mainstream 210mm and 182mm

Cutting dimensions cover the mainstream 210mm and 182mm

Fast cutting speed

Fast cutting speed

Simple operation

Simple operation

Equipment basic parameters

Project Parameters
Applicable battery film size 182mm/210mm (156mm/166mm)
capacity & GE; 600PCS
Delivery 1670x1455x1896mm
Power supply AC380 & Plusmn; 5%, 50Hz
Qi source 0.6-0.8MPa
Vitality > 400L/min
Weight 1.5T